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    Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads

    机译:热机械载荷下无铅电子产品的剩余寿命预测和潜在损坏评估

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    Requirements for system availability for ultrahigh reliability electronic systems such as airborne and space electronic systems are driving the need for advanced health monitoring techniques for the early detection of the onset of damage. Aerospace electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g., during launch and reentry, and thermal environments, including extremely low and high temperatures. Traditional health monitoring methodologies have relied on reactive methods of failure detection often providing little or no insight into the remaining useful life of the system. In this paper, a mathematical approach for the interrogation of the system state under cyclic thermomechanical stresses has been developed for six different lead-free solder alloy systems. Data have been collected for leading indicators of failure for alloy systems, including $hbox{Sn3}hbox{Ag0.5}hbox{Cu}$, $hbox{Sn0.3}hbox{Ag0.7}hbox{Cu}$, $hbox{Sn1}hbox{Ag0.5}hbox{Cu}$, $hbox{Sn0.3}hbox{Ag0.5}hbox{Cu0.1}hbox{Bi}$, $ hbox{Sn0.2}hbox{Ag0.5}hbox{Cu0.1}hbox{Bi0.1}hbox{Ni}$, and 96.5 $hbox{Sn3.5}hbox{Ag}$ second-level interconnects under the application of cyclic thermomechanical loads. The methodology presented resides in the prefailure space of the system in which no macroindicators such as cracks or delamination exist. Systems subjected to thermomechanical damage have been interrogated for the system state and the computed damage state correlated with the known imposed damage. The approach involves the use of condition monitori ng devices which can be interrogated for damage proxies at finite time intervals. The interrogation techniques are based on the derivation of damage proxies and system prior-damage-based nonlinear least square methods, including the Levenberg–Marquardt algorithm. The system's residual life is computed based on residual-life computation algorithms.
    机译:对诸如机载和太空电子系统之类的超高可靠性电子系统的系统可用性的要求,驱使了对先进的健康监测技术的需求,以便及早发现损坏的发生。航空电子系统通常面临非常恶劣的环境,要求它们在高应变率下(例如在发射和再进入期间)以及热环境(包括极低和高温)中生存。传统的健康监控方法学依赖于故障检测的反应性方法,这些方法通常很少或根本无法了解系统的剩余使用寿命。本文针对六种不同的无铅焊料合金系统,开发了一种在循环热机械应力下询问系统状态的数学方法。已收集了合金系统故障的主要指标数据,包括 $ hbox {Sn3} hbox {Ag0.5} hbox {Cu} $ , $ hbox {Sn0.3} hbox {Ag0.7} hbox {Cu} $ , $ hbox {Sn1} hbox {Ag0.5} hbox {Cu} $ ,<公式Formulatype =“ inline”> $ hbox {Sn0.3} hbox {Ag0.5} hbox {Cu0.1} hbox {Bi} $ ,<公式Formulatype =“ inline”> $ hbox {Sn0.2} hbox {Ag0.5} hbox {Cu0.1} hbox {Bi0.1} hbox {Ni} $ 和96.5 $ hbox {Sn3.5} hbox {Ag} $ 二级互连。所提供的方法论存在于系统的故障前空间中,在该空间中不存在诸如裂纹或分层之类的宏观指标。已经对遭受热机械损坏的系统询问了系统状态,并且计算出的损坏状态与已知的施加的损坏相关。该方法涉及使用状态监视设备,可以在有限的时间间隔内查询是否存在损坏代理。询问技术基于损坏代理的推导和基于系统先损伤的非线性最小二乘法,包括Levenberg-Marquardt算法。系统的剩余寿命是根据剩余寿命计算算法计算的。

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